Hamamatsu Photonics UK on Stand C01

New board level cameras featuring high sensitivity back-thinned CCD devices

Introducing at Photonex 2008, the new C9260 series of OEM board level cameras featuring the latest high resolution back thinned CCD image sensors, the S10140 series. The CCDs and board cameras have been developed specifically for use in spectroscopic applications and for other scientific low light level measurement purposes.

The board level camera is equipped with an integrated peltier cooler and controller to operate the range of available CCD chips at 0ºC and a choice of IEE1394 (“firewire”) or USB2 interface to allow external computer control. The board camera allows full pixel binning for all spectroscopy applications and full frame readout for low intensity imaging applications. In addition, the camera allows TDI (time delay integration) mode readout for in-line inspection applications, offering far higher sensitivity than conventional linescan cameras. The device is available with 1024 element or 2048 element long CCDs, with a choice of detector height to match the application.

The new sensors are ideal for applications such as low light level UV imaging, raman spectrometry, semi-conductor inspection, drug discovery, DNA analysis, biomedical instrumentation, fluorescence spectroscopy, in-line industrial inspection, as well as many other scientific applications.

Also new for PHOTONEX will be StockerYale's Flat-Top² Generator, a laser beam shaping module that converts a Gaussian beam into a focused, collimated, or diverging flat-top profile. This innovative product can maintain a high degree of uniformity, power, and intensity over large distances and is ideally suited to illumination in bio-instrumentation.

Complete inspection systems include the IPD VA61 compact machine vision solution with the new colour iNspect software. Colour iNspect is a versatile and easy to use inspection tool that can be applied across a wide range of industries. The underlying toolset includes capabilities for positioning, measuring, identification and flaw detection.

The VA61 contains all the processing power in a rugged enclosure, instead of the camera head. It supports multiple GigE cameras and has an additional GigE compliant network port.

www.framos.co.uk


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