|
 Engis UK will be showing its new ultra-small footprint 4-way, double-sided lapping and polishing machine, designed specifically for research applications and short production runs in precision optic and small component manufacture, for the first time in the UK at PHOTONEX.
The Engis 432 is extremely flexible and - using Engis diamond processing products - can be used to lap most precision optics and advanced materials, including sapphire, GaN and SiC. The machine can be operated in unmanned mode, either “timed” or “thickness controlled” if required, while still maintaining its accuracy and repeatability.
Despite its compact size, this small machine has a generous component envelope of 55mm diameter, with 18mm maximum thickness, making it capable of producing a wide range of precision components. But, at the same time, the small scale of the lapping surface creates a significant benefit in enabling the machine to lap and polish ultra-thin pieces that would be impossible on larger dual face machines.
Easy accessibility is provided by a manual lift-off top plate, simplifying the removal of components and minimising component breakage, contamination of the working zone and the subsequent need for cleaning down or pad replacement.
Engis UK Managing Director, John Wellings, explains; “Our knowledge of the industry led us to realise that there was a real need for a machine of this size and capability as it satisfies a range of different user needs, in addition to volume production of small components, it can also be used to manufacture short runs which are not economically viable on large double sided machines, but too demanding to produce on single sided machines, as well as the manufacture of pre-production components.
Technical Data
Lapping/polishing plate diameter - 195mm
Lapping/polishing track width - 60mm
CarrierS - 5 no. 32-tooth carriers
Maximum part thickness - 18mm
Maximum part diameter - 55mm
Variable speed with digital display - 0-100 rpm (reversible)
Digital cycle timer control - 0-99hours
Auto part thickness control - TESA read-out and probe
Operating voltage - 220/240v single phase
Dimensions - 430mm w x 6660mm d x 890mm h
Estimated shipping weight-70kg
Optional equipment
Cast iron lap plates
Stainless steel polishing plates for pad polishing
Composite metal diamond polishing plates
Abrasive lapping slurry pump and agitation system
Peristaltic pump and stirrer system
Diamond dispensing system
|
